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JEDEC J-STD-035
JEDEC J-STD-035 JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS standard by JEDEC Solid State Technology Association, 05/01/1999
$14.00 $35.00 -60%In Stock -
JEDEC JEP113-B
JEDEC JEP113-B SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES standard by JEDEC Solid State Technology Association, 05/01/1999
$22.40 $56.00 -60%In Stock -
JEDEC JESD51-6
JEDEC JESD51-6 INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR) standard by JEDEC Solid State Technology Association, 03/01/1999
$19.20 $48.00 -60%In Stock -
JEDEC JESD51-7
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES standard by JEDEC Solid State Technology Association, 02/01/1999
$21.20 $53.00 -60%In Stock -
JEDEC JESD67
JEDEC JESD67 I/O DRIVERS AND RECEIVERS WITH CONFIGURABLE COMMUNICATION VOLTAGE, IMPEDANCE, AND RECEIVER THRESHOLD standard by JEDEC Solid State Technology Association, 02/01/1999
$22.40 $56.00 -60%In Stock -
JEDEC JESD51-5
JEDEC JESD51-5 EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS standard by JEDEC Solid State Technology Association, 02/01/1999
$19.20 $48.00 -60%In Stock -
JEDEC JEP134
JEDEC JEP134 GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS standard by JEDEC Solid State Technology Association, 09/01/1998
$22.40 $56.00 -60%In Stock -
JEDEC JEP132 (R2007)
JEDEC JEP132 (R2007) PROCESS CHARACTERIZATION GUIDELINE standard by JEDEC Solid State Technology Association, 07/01/1998
$30.40 $76.00 -60%In Stock -
JEDEC JESD63
JEDEC JESD63 STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPERATURE standard by JEDEC Solid State Technology Association, 02/01/1998
$31.20 $78.00 -60%In Stock -
JEDEC EIA 670
JEDEC EIA 670 QUALITY SYSTEM ASSESSMENT (SUPERSEDES JESD39-A) standard by JEDEC Solid State Technology Association, 06/01/1997
$32.00 $80.00 -60%In Stock -
JEDEC JESD59
JEDEC JESD59 BOND WIRE MODELING STANDARD standard by JEDEC Solid State Technology Association, 06/01/1997
$22.40 $56.00 -60%In Stock -
JEDEC JESD51-4
JEDEC JESD51-4 THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP) standard by JEDEC Solid State Technology Association, 02/01/1997
$22.40 $56.00 -60%In Stock
