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IEC 60191-6-18 Ed. 1.0 b CORR2:2010
New product
IEC 60191-6-18 Ed. 1.0 b CORR2:2010 Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
en, Corrigenda by International Electrotechnical Commission, 07/28/2010