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TIA TSB-144
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TIA TSB-144 2003 Edition, April 1, 2003 Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges
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Description / Abstract:
The bulletin is applicable to fiber optic component reliability.
The document is written for fiber optic component manufacturers, as
well as end-users, and was prepared by TIA Working Group FO-6.3.1,
Adhesives Reliability under the cognizance of FO-6.3 SC
Subcommittee on Interconnecting Devices and Passive Products.