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JEDEC JESD22-B109A FLIP CHIP TENSILE PULL standard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JESD 78B IC LATCH-UP TEST standard by JEDEC Solid State Technology Association, 12/01/2008
JEDEC JEP 148A RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENT standard by JEDEC Solid State Technology Association, 12/01/2008
JEDEC JESD50B.01 SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT standard by JEDEC Solid State Technology Association, 11/01/2008
JEDEC JESD15-1 COMPACT THERMAL MODEL OVERVIEW standard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD15 THERMAL MODELING OVERVIEW standard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD22-A113F PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING standard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD15-4 DELPHI COMPACT THERMAL MODEL GUIDELINE standard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD201A ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHED standard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JESD30E DESCRIPTIVE DESIGNATION SYSTEM FOR SEMICONDUCTOR-DEVICE PACKAGES standard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JEP 155 RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION standard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JESD51-31 THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES standard by JEDEC Solid State Technology Association, 07/01/2008